Electronics Cooling & Thermal Management
From board and component level up to cabinet and data centre scale; battery packs, power electronics, transformers and cold plates.
What we do
Electronics cooling spans a wide range of scales: from a millimetre-sized hot spot on a die to air distribution down a data centre aisle. At every scale the question is the same — where will the heat leave, and how much temperature difference will build up on the way?
Scales
- Component — die, power module, heat spreader, thermal interface material
- Board — component placement on the PCB, effect of copper layers
- Cabinet — fan selection, air path design, recirculation problems
- Room / data centre — hot and cold aisles, CRAC placement, bypass
Products
Battery packs and cold plates, power electronics, power transformers, drive and converter cabinets, camera and sensor enclosures.
Example problems
Aerothermal design of camera and sensor enclosures against rain and fogging. Analysis of the radiator group used for traction converter cooling together with its axial fan, validated against supplier test data.
Related services
CFD Analysis
Internal and external flow, multiphase, combustion, turbomachinery. From incompressible to supersonic regimes; the approach is chosen to fit the problem.
Read moreThermal Analysis
Conjugate heat transfer (CHT), transient regimes, radiation, thermal management. Temperature and thermal stress from component to system over the duty cycle.
Read moreAerothermodynamics
Aerodynamic heating, thermal protection system (TPS) and ablation modelling, plume interaction and base heating. Flight-phase thermal environments for high-speed vehicles.
Read more