Electronics & High Technology
Thermal management at board, cabinet and system level; batteries and power electronics.
What we work on
- The thermal resistance chain at die, power module and spreader level
- PCB layout and the effect of copper layers on heat spreading
- Cabinet air path design, fan selection, recirculation
- Battery packs: cell temperature distribution, cold plate design
- Power transformers: oil flow, winding temperature, radiator performance
- Condensation and humidity control inside enclosures
Why it should be done early
When a thermal problem is attacked after the board is finished, the options have already narrowed: a bigger heatsink and a noisier fan. An analysis done at the layout stage often removes the need for a heatsink altogether.
Technical notes for this field
- Where does cooling actually fail: data centre or enclosure?
- Conjugate heat transfer: when must you solve the solid?
- Thermal contact resistance: the one not in the catalogue
- How is a heat pipe modelled?
- Impinging jets: highest heat transfer, hardest prediction
- Cooling an electric motor: put the losses in the right place
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